Comparison ledger
Disco DFL7340-stealth-dicer, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15Lapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | 200mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DFL7340-stealth-dicer | Lapmaster 15 |
| Specifications | ||
| OEM | Disco[1] | — |
| Model | DFL7340[1] | — |
| Process area | Packaging[1] | — |
| Compatible materials | Dedicated to dicing Si wafers only[1] | — |
| Laser engine wavelength | λ = 1342 nm[1] | — |
| Maximum sample diameter | 200 mm[1] | — |
| Dicing orientation | Topside or backside (through tape) dicing possible[1] | — |
| Si resistivity requirement | ρ > 0.01 Ω•cm[1] | — |
| Surface roughness requirement | Dicing streets must be smooth (mirror polish) on the surface where the laser is incident[1] | — |
| Street clearance requirement | Wafer must be metal-free in a width 0.4 × substrate thickness, centred on the dicing street[1] | — |
| Input Power | — | 110 Vac[2] |
| Plate Diameter | — | 15 inches (381 mm)[3] |
| Number of Conditioning Rings | — | 3[3] |
| Ring ID | — | 5.5 inches (140 mm)[3] |
| Standard RPM | — | 60[3] |
| RPM Range (Variable Speed Drive) | — | 0-60[3] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[3] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[3] |
| Length | — | 25 inches (635 mm)[3] |
| Width | — | 20 inches (508 mm)[3] |
| Height | — | 24 inches (610 mm)[3] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[3] |
Plan your fab
Building a Dicing & Grinding process? Get a complete equipment list.
Open the fab equipment planner →