Disco
DFL7340-stealth-dicer
Wafer size
200mm
Optics
λ = 1342 nm[1]
What is it?
What can it run?
Process applications and technology nodes documented for this tool.
- Dicing silicon wafers
What do the numbers mean?
Wafer handling2
- Street clearance requirement
- Wafer must be metal-free in a width 0.4 × substrate thickness, centred on the dicing street[1]
Optics & imaging2
- Surface roughness requirement
- Dicing streets must be smooth (mirror polish) on the surface where the laser is incident[1]
Configuration & options6
Where are the manuals?
Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.
Not publicly documented
Field notes
No research found yet — worked with this tool? Share what you know.
Frequently asked questions
What material is this dicer dedicated to?
It is dedicated to dicing silicon wafers only.[1]
What wafer size can it handle?
The maximum sample diameter is 200 mm.[1]
Can it dice from both sides of the wafer?
Yes. Topside dicing or backside dicing through tape is possible.[1]
What wafer surface condition is required at the dicing street?
The surface where the laser is incident must be smooth with a mirror-polish finish.[1]
Not publicly documented
The following facts about the DFL7340-stealth-dicer are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the DFL7340-stealth-dicer are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the DFL7340-stealth-dicer are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the DFL7340-stealth-dicer are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the DFL7340-stealth-dicer are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the DFL7340-stealth-dicer is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No research found yet — worked with this tool? Share what you know.
Sources & citations
Sources (1)Every fact above is drawn from these public sources
- [1]confluence.nanofab.ualberta.ca — confluence.nanofab.ualberta.caconfluence.nanofab.ualberta.ca
Last updated Jul 29, 2026.
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