DFL7340-stealth-dicer

The Disco DFL7340 stealth dicing system is equipment in the Packaging process area. The Disco DFL7340 stealth dicing system is available for dicing silicon wafers. The Disco DFL7340 stealth dicing system has a maximum sample diameter of 200 mm. The Disco DFL7340 stealth dicing system supports topside dicing or backside dicing through tape.^[1]

The Disco DFL7340 stealth dicing system is dedicated to dicing Si wafers only with an SDE03 engine at λ = 1342 nm. The Disco DFL7340 stealth dicing system requires dicing streets to be smooth with a mirror-polish surface where the laser is incident. The Disco DFL7340 stealth dicing system requires the wafer to be metal-free in a width of 0.4 times the substrate thickness centered on the dicing street. The Disco DFL7340 stealth dicing system requires Si resistivity greater than 0.01 Ω•cm.^[1]

Stealth dicing belongs near the end of wafer processing, after device fabrication and after the wafer layout has defined dicing streets. Stealth dicing comes before die sort, pick-and-place, bonding, and package assembly operations that handle individual chips rather than whole wafers.

The Disco DFL7340 stealth dicing system is used for dicing silicon wafers. The Disco DFL7340 stealth dicing system is dedicated to Si wafers only. The Disco DFL7340 stealth dicing system may be feasible for wafers containing materials other than Si in the dicing streets if evaluated by staff. The Disco DFL7340 stealth dicing system can dice from the backside through tape when topside dicing streets contain metal or other incompatible materials, provided the backside is smooth and metal-free.^[1]