Comparison ledger
Disco DTG 8460 Wafer Backside, Lapmaster 15, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 15Lapmaster | |
|---|---|---|
| OEM | Disco | Lapmaster |
| Category | Dicing & Grinding | Dicing & Grinding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Disco DTG 8460 | Lapmaster 15 |
| Specifications | ||
| Configuration | Includes DTU 1550[1] | — |
| Chuck table for 12 | , and 8" is possible[1] | — |
| Each spindle has 2 height gauge | inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[1] | — |
| Machine type | Wafer backside grinder[2] | — |
| Wafer size | 12 inch[2] | — |
| Accessory | Includes DTU 1550[1] | — |
| Chuck table | For 12", and 8" is possible[2] | — |
| Robot picker | For 12", and 8" is possible[2] | — |
| Spinner table | For 12", and 8" is possible[2] | — |
| Height gauge | Each spindle has 2 height gauge: inner and outer mechanical IPG (in-line process gauge) on Z1 and Z2 spindles respectively[2] | — |
| Includes | DTU 1550[2] | — |
| Input Power | — | 110 Vac[3] |
| Plate Diameter | — | 15 inches (381 mm)[4] |
| Number of Conditioning Rings | — | 3[4] |
| Ring ID | — | 5.5 inches (140 mm)[4] |
| Standard RPM | — | 60[4] |
| RPM Range (Variable Speed Drive) | — | 0-60[4] |
| Drive Motor - Lapper | — | 0.5 HP (0.37 kW)[4] |
| Drive Motor - Polisher | — | 0.75 HP (0.56 kW)[4] |
| Length | — | 25 inches (635 mm)[4] |
| Width | — | 20 inches (508 mm)[4] |
| Height | — | 24 inches (610 mm)[4] |
| Estimated Shipping Weight | — | 285 lbs (129.3 kg)[4] |
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