Comparison ledger
Electroglas 1034, Teradyne Nextest Magnum II X GV, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1034Electroglas | Nextest Magnum II X GVTeradyne |
|---|---|---|
| OEM | Electroglas | Teradyne |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Electroglas 1034 | Teradyne Nextest Magnum |
| Specifications | ||
| Test head | — | 8 Chassis[1] |
| Configuration | — | HSB 3 (qty 16)[1] |
| DBM Size | — | 18(2) GBIT[1] |
| ECRM Size | — | 72(4) GBIT[1] |
| RCM Size | — | 36(2) Mbit[1] |
| HSB 3 | — | qty 16[1] |
| PE 63 | — | qty 64[1] |
| DP3X | — | qty 64[1] |
| IPC | — | qty 4[1] |
| DPO | — | qty 4[1] |
| Total Channels | — | 4096[1] |
| Tester Computer | — | Dell T3500[1] |
| Operating System | — | Windows Server 2003[1] |
| Type | — | semiconductor tester[2] |
| Use | — | semiconductor test and probe operations[2] |
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