Waferpedia

Comparison ledger

120 Automated Coater ProcessingversusDelta 12 AQ

EV Group 120 Automated Coater Processing, SUSS MicroTec Delta 12 AQ, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
Delta 12 AQSUSS MicroTec
OEMEV GroupSUSS MicroTec
CategoryResist ProcessingResist Processing
Wafer size—Wafer Developing System Configuration
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyEV Group 120 Automated Coater ProcessingSUSS MicroTec Delta
Specifications
Configuration50/60 Hz[1]Software is not included[2]
Phase3 Phase[1]—
Wafer sizes6 inch, 8 inch[1]—
Frequency50/60 Hz[1]—
Wiring configuration4 Wire + GND[1]—
Vintage2015[1]2009
Maximum wafer diameter—200 mm (8 in)[3]
Maximum substrate thickness—5 mm[3]
Supported wafer diameters—50 mm (2 in), 75 mm (3 in), 100 mm (4 in), 150 mm (6 in), 200 mm (8 in)[3]
Supported photomask sizes—125 mm x 125 mm, 150 mm x 150 mm[3]
Supported developer chemistries—AZ400K, AZ300MIF, CD26[3]
Process type—temperature controlled spray photoresist development, cassette-to-cassette, dry in – dry out[3]
Operation control—Recipe controlled automated operation with precise temperature control[3]
Wafer size—Wafer Developing System Configuration
Coaters & Developers Vintage—2009
Development method—temperature controlled spray development[3]
Operation mode—cassette-to-cassette, recipe controlled[3]
Small pieces supported—No[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]inventory listing
  3. [3]nist.govnist.gov