Comparison ledger
Finetech Fineplacer Lambda, Finetech Fineplacer Lambda Sub Micron, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Fineplacer LambdaFinetech | Fineplacer Lambda Sub MicronFinetech |
|---|---|---|
| OEM | Finetech | Finetech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2017 Vintage year |
| Control system | — | — |
| Generation | — | — |
| Family | Finetech Fineplacer Lambda | Finetech Fineplacer Lambda |
| Specifications | ||
| Configuration | HDD and Software[1] | HDD and Software[5] |
| Placement accuracy | sub-micron[2] | 0.5 µm[6] |
| Bonding force | 500 N[1] | — |
| Bonding technologies | Thermocompression, ultrasonic/thermosonic, ACF bonding, UV cure, C4 chip bonding[3] | — |
| Vision alignment system | Dual-image overlay with stationary beam splitter[3] | — |
| Substrate size (max) | 50 mm square[4] | — |
| Die size (min) | 2–3 mm[4] | — |
| Substrate thickness range | 0 to 10 mm[3] | — |
| Heated stage option | available[4] | — |
| Heated placement tool option | available[4] | — |
| Bonding technology | die bonding (as die bonder)[1] | — |
| Force option | 500N Force[1] | — |
| Vision system | patented advanced Vision Alignment System[3] | — |
| Alignment principle | imaging two orthogonal images simultaneously into one common image plane[3] | — |
| System type | sub-micron bonding system[3] | — |
| Module interface | Finetech Module Interface (FMI)[3] | — |
| Mains voltage | Mains voltage out, max 10A load (fuse)[3] | — |
| Accessory optics | special optics for positioning large fine pitch devices, high magnification systems[3] | — |
| Maximum bonding force | 500 N[1] | — |
| Interface | RS-232[3] | — |
| Vacuum | Built-in vacuum pump[3] | — |
| Adjustment set resolution | 1 µm[3] | — |
| Maximum force | 500N[1] | — |
| Accuracy | — | 0.5 µm[5] |
| Bonding force module | — | FD3[6] |
| Chip heating module | — | Included[6] |
| Optional dispensing module | — | FG3[5] |
| Software | — | WinFlipChip version 3.2 Revision 052[5] |
| PC | — | Included[6] |
| HDD | — | Included[5] |
| Category | — | Packaging & Bonding[6] |
| Equipment type | — | Die bonder[5] |
| Dispensing module | — | Optional FG3[6] |
| HDD and Software | — | Included[5] |
| Vintage | — | 2017[5] |
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