Comparison ledger
Hesse & Knipps Bondjet LSB959, Logitech 1 WBS 1 Wafer Substrate, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Bondjet LSB959Hesse & Knipps | 1 WBS 1 Wafer SubstrateLogitech |
|---|---|---|
| OEM | Hesse & Knipps | Logitech |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hesse & Knipps Bondjet LSB959 | Logitech 1 WBS 1 Wafer Substrate |
| Specifications | ||
| Machine type | Fully automatic heavy wire bonder[1] | — |
| Function | Thermosonic function[1] | — |
| Product line | Bondjet[1] | — |
| Laser source | IR fiber laser[2] | — |
| Laser power | Up to 130 W[2] | — |
| Bondtool tip temperature | 400-500 °C[2] | — |
| Interface temperature | 150-200 °C[2] | — |
| Frequency | 60 kHz[2] | — |
| Wire diameter | Cu: 300 μm – 500 μm[2] | — |
| Working area X | 370 mm[2] | — |
| Working area Y | 560 mm[2] | — |
| Working area Z | 42 mm[2] | — |
| P-rotation | 440°[2] | — |
| Footprint | 805 x 1634 x 1912 mm[2] | — |
| Weight | ca. 1300 kg[2] | — |
| Power supply | 230V AC[2] | — |
| Connectivity | Gigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air, vacuum, process gas[2] | — |
| Operation modes | Fully automatic or manual[2] | — |
| Process modes | Classic ultrasonic heavy wire bonding and thermosonic heavy wire bonding[2] | — |
| Laser safety class | Laser class 1[2] | — |
| Type | Fully automatic heavy wire bonder[1] | — |
| Wafer Size | — | 6 inch[3] |
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