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Comparison ledger

Bondjet LSB959versus10490

Hesse & Knipps Bondjet LSB959, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
Bondjet LSB959Hesse & Knipps
10490West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps Bondjet LSB959West Bond 10490
Specifications
Machine typeFully automatic heavy wire bonder[1]—
FunctionThermosonic function[1]—
Product lineBondjet[1]—
Laser sourceIR fiber laser[2]—
Laser powerUp to 130 W[2]—
Bondtool tip temperature400-500 °C[2]—
Interface temperature150-200 °C[2]—
Frequency60 kHz[2]—
Wire diameterCu: 300 μm – 500 μm[2]—
Working area X370 mm[2]—
Working area Y560 mm[2]—
Working area Z42 mm[2]—
P-rotation440°[2]—
Footprint805 x 1634 x 1912 mm[2]—
Weightca. 1300 kg[2]—
Power supply230V AC[2]—
ConnectivityGigabit-Ethernet (TCP/IP), USB-Ports, HDMI, compressed air, vacuum, process gas[2]—
Operation modesFully automatic or manual[2]—
Process modesClassic ultrasonic heavy wire bonding and thermosonic heavy wire bonding[2]—
Laser safety classLaser class 1[2]—
TypeFully automatic heavy wire bonder[1]—
Manufacturer—West Bond[3]
Model—10490[3]
Description—Convertible bonder, wedge to ball[4]
Tool type—Convertible bonder[5]
Bonding modes—Wedge bonding and ball bonding[5]
Use—Wire bonding[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]hesse-mechatronics.comhesse-mechatronics.com
  2. [2]hesse-mechatronics.comhesse-mechatronics.com
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com