Waferpedia

Comparison ledger

Bondjet 820 Wire Wedgeversus10490

Hesse & Knipps Bondjet 820 Wire Wedge, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.

Email
Side-by-side comparison of selected equipment models
Attribute
10490West Bond
OEMHesse & KnippsWest Bond
CategoryPackaging & BondingPackaging & Bonding
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHesse & Knipps Bondjet 820West Bond 10490
Cited variants—
Specifications
ConfigurationVersion 2[1]—
OEMHesse & Knipps (H&K)[1]—
ModelBondjet 820[1]10490[3]
Equipment typeWire Wedge Bonder[1]—
VersionVersion 2[1]—
Bondhead60°[1]—
E-boxincluded[1]—
Vintage2014[1]—
Manufacturer—West Bond[3]
Description—Convertible bonder, wedge to ball[4]
Tool type—Convertible bonder[5]
Bonding modes—Wedge bonding and ball bonding[5]
Use—Wire bonding[5]

Plan your fab

Building a Packaging & Bonding process? Get a complete equipment list.

Open the fab equipment planner →
Sources (5)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]Equipment inventory listing
  3. [3]Equipment inventory listing
  4. [4]fabsurplus.comfabsurplus.com
  5. [5]waferpedia.comwaferpedia.com