Bondjet 820 Wire Wedge

A wire wedge bonder is a packaging and interconnect machine used to join fine wire between device pads and package leads or other connection points. Wire wedge bonders are used after device fabrication to create electrical interconnects in assembled components and microelectronic packages.

Wire wedge bonding uses a bonding tool to press wire onto a bond surface while forming an interconnect path from one termination point to another. Wedge bonding commonly relies on force, motion, and energy input at the bond interface to create a metallurgical or mechanical attachment between the wire and the pad.

A wedge bonder typically feeds wire through a bonding head, forms a first bond, traverses to a second site, and then forms a second bond before terminating the wire. A bondhead in this equipment class is the bonding assembly that carries the bonding tool and executes the controlled bonding motion over the work area.

Wire wedge bonders are used in semiconductor packaging and related microelectronics assembly after the die or device has been attached to its substrate, leadframe, carrier, or package base. Wire wedge bonding is followed by later assembly stages such as protection of the interconnects, enclosure, and final electrical test, depending on product flow.

Wire wedge bonders are used to make electrical interconnects in semiconductor packages, hybrid circuits, and other microelectronic assemblies. Wedge bonding is applied where process engineers need wire connections between chips, substrates, terminals, or package features in a controlled assembly environment.