Comparison ledger
Hitachi 1305 BSG 3, LPKF Contac S 4 Through Hole Electroplating, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1305 BSG 3Hitachi | |
|---|---|---|
| OEM | Hitachi | LPKF |
| Category | Wet Processing / Clean | Wet Processing / Clean |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Hitachi 1305 BSG 3 | LPKF Contac S 4 Through Hole Electroplating |
| Specifications | ||
| Make | — | LPKF[1] |
| Model | — | Contac S 4[1] |
| Equipment type | — | Through-hole electroplating equipment[2] |
| Intended use | — | Through-hole plating of double-sided and multi-layer PCBs and galvanic strengthening of copper surfaces[3] |
| Tin plating | — | PCBs can be tin-plated after copper build-up is completed[3] |
| Maximum layers | — | Up to eight layers[4] |
| Maximum aspect ratio | — | 1:10 (hole diameter to PCB thickness)[4] |
| Minimum hole diameter | — | At least 0.2 mm[3] |
| Maximum material size (X x Y) | — | 230 mm x 330 mm[5] |
| Maximum layout area (X x Y) | — | 200 mm x 300 mm[5] |
| Reverse pulse plating | — | Included[5] |
| ViaCleaner | — | Included[5] |
| Chemical tinning | — | Included[5] |
| Process time | — | Approximately 90–120 min[5] |
| Electrical consumption | — | 115/230 V, 50–60 Hz, 0.6 kW[5] |
| Dimensions (W x H x D) | — | 856 mm x 446 mm x 542 mm[5] |
| Weight | — | ~ 80 kg unfilled, ~ 115 kg filled[5] |
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