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Comparison ledger

1305 BSG 3versusPSX 307

Hitachi 1305 BSG 3, Panasonic PSX 307, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
1305 BSG 3Hitachi
PSX 307Panasonic
OEMHitachiPanasonic
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi 1305 BSG 3Panasonic PSX 307
Specifications
Configuration—50/60 Hz[1]
Electric Source—200 / 208 / 220 / 230 / 240 V[1]
Model—PSX 307[1]
Equipment type—Plasma Cleaner[1]
Category—Wet Processing / Clean[2]
Cleaning method—Parallel plate RF back-sputtering method[3]
Gas for electrical discharge—Ar (option: O2)[3]
Pneumatic source—0.49 MPa or more, 6.5 L/min (A.N.R.)[3]
Power source—1-phase AC 200 V, 2.00 kVA (Full Load 5.00 kVA)[3]
Compatible voltage—1-phase 208 / 220 / 230 / 240 V[3]
Dimensions / mass (base configuration)—W 930 mm × D 1 100 mm × H 1 450 mm / 555 kg[3]
Dimensions / mass (S type transfer system)—W 2 113 mm × D 1 100 mm × H 1 450 mm / 850 kg[3]
Dimensions / mass (M type transfer system)—W 2 266 mm × D 1 100 mm × H 1 450 mm / 725 kg[3]
Speed—Up to 360 substrates/strips per hour[3]
Compliance—Semi S2/S8 compliance[3]
Certification—CE certified[3]
Model number—NM-EFP1A[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]waferpedia.comwaferpedia.com
  3. [3]eu.connect.panasonic.comeu.connect.panasonic.com