Waferpedia

Comparison ledger

1305 BSG 3versusMask

Hitachi 1305 BSG 3, SUSS MicroTec Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
1305 BSG 3Hitachi
MaskSUSS MicroTec
OEMHitachiSUSS MicroTec
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi 1305 BSG 3SUSS MicroTec Mask
Specifications
Configuration—TXF from OLED[1]
Model—Mask Cleaner[1]
Make—SUSS[1]
Category—Wet Processing / Clean[1]
Equipment type—Mask aligner[2]
Function—Uses UV light to transfer patterns from photomasks onto substrates coated with photoresist[2]
Exposure modes—Hard contact, soft contact, proximity, flood[2]
Spectral range—365nm – 405nm[2]
Exposure resolution—< 1 µm[2]
Alignment accuracy—Topside – 500nm[2]
Substrate accommodation—Wafers up to 6"[2]
Uniformity—+- 5% over exposure area[2]
Image capture—CCD camera and monitor[2]

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Sources (2)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]ece.utoronto.caece.utoronto.ca