Waferpedia

Comparison ledger

1305 BSG 3versusR3A-LMC

Hitachi 1305 BSG 3, YES R3A-LMC, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
1305 BSG 3Hitachi
OEMHitachiYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyHitachi 1305 BSG 3YES R3A-LMC
Specifications
Model—R3A-LMC[1]
Designed for—fast, uniform cleaning of lead frames and carrier borne devices loaded into one or two open-sided magazines[1]
Chamber design—parallel plate design[1]
Plasma uniformity—uniform plasma throughout the magazine[1]
Plasma modes—Active Plasma mode, RIE Plasma, Electron-free Plasma[1]
Plasma direction—left to right, right to left, or from both sides simultaneously[1]
Plasma gas inputs—two plasma gas inputs[1]
Back-fill gas input—provided for venting the chamber back to atmospheric pressure in an inert atmosphere, normally nitrogen[1]
Diagnostics display—plain English[1]
Readouts—plain English[1]
Function—Automatic plasma cleaning of lead frames and Auer boats[1]
Target products—Lead frames and carrier borne devices loaded into one or two open-sided magazines[1]
Design—Parallel plate design[1]
Gas inputs—Two plasma gas inputs[1]
Control/readout language—Plain English readouts and diagnostics[1]

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Sources (1)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org