R3A-LMC

The YES R3A-LMC is a plasma cleaner for lead frames and carrier-borne devices loaded into one or two open-sided magazines. The YES R3A-LMC is designed for fast, uniform cleaning. The YES R3A-LMC uses a parallel-plate design to provide uniform plasma throughout the magazine. The YES R3A-LMC provides two plasma gas inputs and three plasma modes. The YES R3A-LMC also includes a back-fill gas input for chamber venting.^[1]

The YES R3A-LMC is arranged so plasma and plasma gas flow horizontally over stacked sample surfaces within the magazine. The YES R3A-LMC can be configured for different sample sizes and contamination levels by changing the positions of slide-in electrodes. The YES R3A-LMC can operate in Active Plasma mode for routine use. The YES R3A-LMC can operate in RIE Plasma mode for more aggressive cleaning. The YES R3A-LMC can operate in Electron-free Plasma mode for sensitive electronic components such as C-MOS devices. The YES R3A-LMC can direct plasma from left to right, from right to left, or from both sides simultaneously. The YES R3A-LMC supports quick selection of a single gas or a two-gas sequence, including oxygen followed by argon. The YES R3A-LMC can vent the chamber back to atmospheric pressure in an inert atmosphere, normally nitrogen, at the end of the process.^[1]

The YES R3A-LMC has double safety interlocks on RF, vacuum, and gas control functions. The YES R3A-LMC automatically shuts down in a sealed condition if a control parameter goes out of limit. The YES R3A-LMC provides an audible abort signal and a flashing light during an abort mode. The YES R3A-LMC displays the reason for shutdown and suggested remedial action in plain English.^[1]

Plasma cleaning tools of this class are typically inserted before process steps that depend on a clean and activated surface. Plasma cleaning commonly precedes die attach, wire bonding, underfill, molding, lid seal, coating, or adhesive joining in device and package manufacturing. Plasma cleaning can also be used after handling or storage steps when organic residue or airborne contamination must be reduced before the next operation.

The YES R3A-LMC is intended for cleaning lead frames and carrier-borne devices in magazines. The broader YES plasma cleaning system family is used for devices, leadframes, BGAs, singulated packages in boats, ceramic substrates, and PCBs. The YES R3A-LMC includes an electron-free plasma mode for sensitive electronic components such as C-MOS devices.^[1]