Comparison ledger
KLA .498 PSL Wafer, Onto Innovation MetaPulse 200 Metal Film Measurement, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | MetaPulse 200 Metal Film MeasurementOnto Innovation | |
|---|---|---|
| OEM | KLA | Onto Innovation |
| Category | Metrology & Inspection | Metrology & Inspection |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA .498 PSL Wafer | Onto Innovation MetaPulse 200 |
| Specifications | ||
| Configuration | NIST Traceable[1] | MP200 Double Path Tool Non Copper Tool[2] |
| NIST traceability | Yes[1] | — |
| OEM | KLA[1] | — |
| Category | Metrology & Inspection[1] | — |
| Traceability | Yes[1] | — |
| Description | Particle-sizing calibration standard[1] | — |
| Cooling Water Required Minimum Flow | — | 0.79 GPM (3.00 l/m) Minimum Temperature: 12*C[2] |
| Maximum Temperature | — | 20*C[2] |
| Wafer sizes | — | 6 inch, 8 inch[2] |
| Tool type | — | MP200 Double Path Tool[2] |
| Chuck | — | 6 inch chuck[2] |
| Cooling water minimum flow | — | 0.79 GPM (3.00 l/m)[2] |
| Cooling water minimum temperature | — | 12*C[2] |
| Cooling water maximum temperature | — | 20*C[2] |
| Operating air pressure | — | 14.00 PSI (96,534.20 N/sq m)[2] |
| Vacuum required | — | 0.98 in Hg (24.89 mm Hg)[2] |
| Vintage | — | 2006[2] |
| Wafer diameter | — | 200 mm[3] |
| Year of manufacture | — | 1998[3] |
| Process | — | Wafer inspection[3] |
| Configuration description | — | Pattern Recognition; 200 mm ergonomic cassette-tilt loaders; Pulse Wafer Transport System; 200 mm chuck; 200 mm wafer probe; 200 mm linear positioning stage; Ultrafast 800 nm laser; Programmable motion controller; Color printer (cleanroom approved); 266 MHz Pentium II Motherboard; 2 GB hard drive; CD ROM drive; LCD screen; Keyboard and Trackball; GEM compliant SECS-II[3] |
| Measurement capability | — | Can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal film stack[4] |
| Throughput | — | Up to 60 wafers per hour[4] |
| Measurement spot | — | 10 µm[4] |
| Measurement technique | — | Picosecond ultrasonic laser sonar (PULSE Technology), non-contact, non-destructive measurement based on laser-induced ultrasound[4] |
| Make | — | ONTO / Rudolph[2] |
| Model | — | MetaPulse 200[2] |
| Layer measurement | — | Up to six layers in a multi-layer metal film stack[4] |
| Measurement accuracy | — | Angstrom accuracy[4] |
| Repeatability | — | Sub-Angstrom repeatability[4] |
| Measurement method | — | Non-contact, non-destructive[4] |
| Cooling water requirement | — | Minimum flow 0.79 GPM (3.00 l/m); minimum temperature 12°C; maximum temperature 20°C[2] |
| Vacuum requirement | — | 0.98 in Hg (24.89 mm Hg)[2] |
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