Comparison ledger
KLA Surfscan SP 1 DLS, Lapmaster 12 Lapper, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 12 LapperLapmaster | |
|---|---|---|
| OEM | KLA | Lapmaster |
| Category | CMP | CMP |
| Wafer size | For Wafer Centering Device | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | KLA Surfscan | — |
| Specifications | ||
| Configuration | Upgraded/New[1] | — |
| Wafer size | For Wafer Centering Device[1] | — |
| Defect Sensitivity (Polished Bare Silicon) | 0.050 µm[2] | — |
| Laser Source | Argon Ion Laser (488 nm)[2] | — |
| Wafer Size Support | 200 mm and 300 mm[2] | — |
| Enhanced Rough Film Sensitivity | Yes[2] | — |
| Real Time Defect Classification (RTDC) | Yes[2] | — |
| Defect Map and Histogram with Zoom | Yes[2] | — |
| Map to Map | Yes[2] | — |
| Operator Interface | Yes[2] | — |
| Blower Unit | Yes[2] | — |
| OEM | KLA-Tencor[2] | — |
| Model | SP1 DLS[3] | — |
| Wafer Size | 200/300mm[2] | — |
| Defect Sensitivity | 0.050um on polished bare silicon[2] | — |
| Surface Type | Unpatterned[2] | — |
| Key Feature | Enhanced Rough Film Sensitivity[2] | — |
| Optional Handler | 300mm Single FOUP/FIMS Handler[2] | — |
| Outside plate diameter | — | 12 inches[4] |
| Lapping Speed Range | — | 0 to 60 rpm[5] |
| Wafer Size Compatibility | — | 4 inches or smaller[4] |
| Input Voltage | — | 110 V[4] |
| Frequency | — | 60 Hz[4] |
| Phase | — | 1[4] |
| Number of Rings | — | 3[4] |
| Number of Weights | — | 3[4] |
| Includes Slurry System | — | Yes[4] |
| Includes Timer | — | Yes[4] |