Comparison ledger
Lam Research 2300 Kiyo EX, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 2300 Kiyo EXLam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research 2300 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Polysilicon[2] | — |
| OEM | Lam Research[3] | — |
| Model | 2300 Kiyo EX[2] | — |
| Description | Polysilicon Etch[3] | — |
| Equipment type | Etch/Ash/Clean - Plasma Processing Equipment[3] | — |
| Currently configured for | 300 mm[3] | — |
| Tool model | KIYOEX[3] | — |
| System power rating | 208 AC 3-Phase[3] | — |
| Loading configuration | 3 Load ports[3] | — |
| Chambers | Chamber 1, Chamber 2, Chamber 3[3] | — |
| Chamber descriptions | KIYOEX, KIYOEX, KIYOEX[3] | — |
| Process Type | Polysilicon Etch[3] | — |
| Wafer Size | 300mm[3] | — |
| Load Ports | 3[3] | — |
| Chamber Type | KIYOEX[3] | — |
| N2 Load Port Vendor | JUSTEM[3] | — |
| Tool designation | LAM Research 2300 KIYO EX[3] | — |
| Process | Polysilicon etch[3] | — |
| Chamber count | 3 chambers[3] | — |
| Chamber names | Chamber 1: 1; Chamber 2: 2[3] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
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