Comparison ledger
Lam Research 4520, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 4520Lam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research Rainbow 4520 | Tegal 110 |
| Cited variants |
|
|
| Specifications | ||
| Configuration | Envision Software[3] | — |
| Main Chamber | Top actuate clamping system[4] | — |
| Category | Etch[4] | — |
| Type | etcher[4] | — |
| System description | TCP oxide etch system[5] | — |
| Wafer size | 200 mm[5] | — |
| Software | Envision 1.52[5] | — |
| Wafer handling | Hine cassette indexer load / unload[4] | — |
| Loadlock | Entrance loadlock[4] | — |
| System type | single wafer, vacuum load-locked low pressure oxide etch system[1] | plasma etch system[6] |
| Load / unload | Hine cassette indexer load / unload[4] | — |
| Remote panel | Remote AC Panel[4] | — |
| Endpoint | Monochrometer[5] | — |
| model | — | 110 SE[2] |
| application focus | — | process development applications[2] |
| process capability | — | deep silicon plasma etching[2] |
| capabilities | — | very high aspect ratio trench etch and profile control[2] |
| configuration | — | multiple configurations with minimum technical intervention[2] |
| Supported components | — | MEMS and 3D-IC components[2] |
| Control capability | — | very high aspect ratio trench etch and profile control[6] |
| Physical description | — | compact[2] |
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