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Comparison ledger

9400 SE Polyversus110

Lam Research 9400 SE Poly, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
9400 SE PolyLam Research
110Tegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research 9400 SE PolyTegal 110
Cited variants
  • Lam 9400 SE 308v[1]
Specifications
Voltage308v[1]—
model—110 SE[2]
application focus—process development applications[2]
process capability—deep silicon plasma etching[2]
capabilities—very high aspect ratio trench etch and profile control[2]
configuration—multiple configurations with minimum technical intervention[2]
System type—plasma etch system[3]
Supported components—MEMS and 3D-IC components[2]
Control capability—very high aspect ratio trench etch and profile control[3]
Physical description—compact[2]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]waferpedia.comwaferpedia.com