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Comparison ledger

Rainbow 4526 XLversus110

Lam Research Rainbow 4526 XL, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
Rainbow 4526 XLLam Research
110Tegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research Rainbow 4526Tegal 110
Cited variants—
Specifications
ConfigurationOxide Etch[2]—
Wafer typeJeida flat[2]—
Valve typeVAT 65[2]—
SoftwareEnvision 1.6.1-005[2]—
RFENI-GHW50 / ENI-2MHz[2]—
RobotHarmonic Drive[2]—
LoaderHine Indexers 38A[2]—
LoadlockEntrance & Exit LL[2]—
Turbo PumpHGP Pump[2]—
ControllersHGP / VAT 65[2]—
ManufacturerLam Research[2]—
ModelRainbow 4526 XL[2]—
CategoryEtch[3]—
Tool typePlasma etcher[2]—
ProcessOxide etch[2]—
Wafer sizes6 inch, 8 inch[2]—
ESCPresent[2]—
EndpointMonochromator Endpoint[2]—
RF cartPresent[2]—
Gas chamberPresent[2]—
Ar485.0 sccm[2]—
CF420.0 sccm[2]—
CHF320.0 sccm[2]—
C4F819.5 sccm[2]—
CO200.0 sccm[2]—
O2 LOW20.0 sccm[2]—
O2 HIGH1000.0 sccm[2]—
N2100.0 sccm[2]—
model—110 SE[1]
application focus—process development applications[1]
process capability—deep silicon plasma etching[1]
capabilities—very high aspect ratio trench etch and profile control[1]
configuration—multiple configurations with minimum technical intervention[1]
System type—plasma etch system[4]
Supported components—MEMS and 3D-IC components[1]
Control capability—very high aspect ratio trench etch and profile control[4]
Physical description—compact[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]waferpedia.comwaferpedia.com