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Comparison ledger

SEZ RST 201 Spinversus110

Lam Research SEZ RST 201 Spin, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
SEZ RST 201 SpinLam Research
110Tegal
OEMLam ResearchTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLam Research SEZ RST 201 SpinTegal 110
Cited variants—
Specifications
Wafer Size6 inch[2]—
TypeSpin Etcher[2]—
Vintage1997[2]—
model—110 SE[1]
application focus—process development applications[1]
process capability—deep silicon plasma etching[1]
capabilities—very high aspect ratio trench etch and profile control[1]
configuration—multiple configurations with minimum technical intervention[1]
System type—plasma etch system[3]
Supported components—MEMS and 3D-IC components[1]
Control capability—very high aspect ratio trench etch and profile control[3]
Physical description—compact[1]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]Equipment inventory listing
  3. [3]waferpedia.comwaferpedia.com