Comparison ledger
Lam Research TCP 9600 Metal, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TCP 9600 MetalLam Research | 110Tegal |
|---|---|---|
| OEM | Lam Research | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Lam Research TCP 9600 | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | SMIF[2] | — |
| Supported wafer sizes | 150mm (6 inch) and 200mm[3] | — |
| Process pressure range | 0 - 100 mTorr[4] | — |
| Top electrode power | 0 - 1250 W[4] | — |
| Lower electrode power | 0 - 1200 W[4] | — |
| Process temperature | 55 °C[4] | — |
| Process gases | Cl2, BCl3, HBr, SF6, CF4, Ar, N2, O2, He[4] | — |
| Endpoint detection | Adjustable monochromator[4] | — |
| Wafer clamp | Electrostatic chuck (ESC) with helium backside cooling[5] | — |
| Electrode gap | Fixed gap 8 inch TCP coil[5] | — |
| Number of RF generators | 3 (AE RFG 1250)[5] | — |
| Power supply requirements | 208V, 80A, 3-Phase, 50/60Hz[5] | — |
| DSQ strip module | Included[4] | — |
| Software version | Envision 1.6.1-012[5] | — |
| Aluminum etch rate | > 8000 Å/min[3] | — |
| Aluminum non-uniformity | +/- 15%[3] | — |
| System uptime | Typically > 85%[3] | — |
| Mean time to change (MTTC) | 12 hours[3] | — |
| Mean time between failures (MTBF) | > 125 hours[3] | — |
| Mean time to repair (MTTR) | < 4 hours[3] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[7] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[7] |
| Physical description | — | compact[1] |
Plan your fab
Building a Etch process? Get a complete equipment list.
Open the fab equipment planner →