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Comparison ledger

12 LapperversusLSP 6

Lapmaster 12 Lapper, Lapmaster LSP 6, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
12 LapperLapmaster
LSP 6Lapmaster
OEMLapmasterLapmaster
CategoryCMPCMP
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
Family—Lapmaster LSP 6
Specifications
Outside plate diameter12 inches[1]—
Lapping Speed Range0 to 60 rpm[2]—
Wafer Size Compatibility4 inches or smaller[1]—
Input Voltage110 V[1]—
Frequency60 Hz[1]60 Hz[4]
Phase1[1]3 Phase[3]
Number of Rings3[1]—
Number of Weights3[1]—
Includes Slurry SystemYes[1]—
Includes TimerYes[1]—
Voltage—230V[4]
Type—grinder/polisher[4]
Process type—4-way, planetary, dual face lapping and polishing machine[5]
Electrical service—230 Volts, 60 Hz, 3 Ph.[5]
Power & electrical—3 Phase[4]
Standard feature—programmable process controller[5]

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Sources (5)Every fact above is drawn from these public sources
  1. [1]jmind.comjmind.com
  2. [2]etd.ohiolink.eduetd.ohiolink.edu
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com
  5. [5]web.archive.orgweb.archive.org