LSP 6

CMP and lapping and polishing equipment removes material in a controlled way to improve flatness, thickness uniformity, and surface finish. Dual-face machines in this class process workpieces between opposed plates so both sides can be finished during the same operation.

The Lapmaster LSP 6 is a 4-way, planetary, dual face lapping and polishing machine with a control system. The Lapmaster LSP 6 has a programmable process controller. The Lapmaster LSP 6 has pneumatic top plate weight control with load cell feedback. The Lapmaster LSP 6 includes in-process lap plate flattening. The Lapmaster LSP 6 includes an abrasive slurry distribution system with a propeller type agitator. The Lapmaster LSP 6 has transparent safety guards with machine access from two sides. The Lapmaster LSP 6 has a retractable ring gear for loading and unloading. The Lapmaster LSP 6 has anti-vibration mounting and leveling pads.^[2]

Machines in this class are used after a substrate or component has been formed and before downstream inspection, bonding, coating, assembly, or other finishing steps that depend on surface flatness and thickness control. In semiconductor and precision-component flows, lapping and polishing tools are commonly placed where a surface must be planarized, smoothed, or brought into tighter parallelism before the next process stage.

Equipment in this class is used on wafers, substrates, optics, ceramics, metals, and other precision parts when both geometry and surface condition matter. Dual-face lapping and polishing is commonly chosen for parts that need controlled thickness, improved parallelism, reduced warp, or a refined surface on both faces.