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Comparison ledger

, Vistec INS 3000versusLabSpin6 / 8

Leica , Vistec INS 3000, SUSS MicroTec LabSpin6 / 8, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
LabSpin6 / 8SUSS MicroTec
OEMLeicaSUSS MicroTec
Category——
Wafer size200mm200mm
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyLeica , Vistec INS 3000SUSS MicroTec LabSpin6 / 8
Specifications
Wafer sizeSingle 150/200 mm wafer loadport[1]up to 200 mm[3]
TypeOptical defect review station[1]—
Wafer loadportSingle 150/200 mm wafer loadport[1]—
LightingBright field light source; DIC DUV light source[1]—
CameraUV and DUV camera[1]—
Optics6 optics: 150x, 100x, 50x, 25x, 10x, 5x[1]—
SoftwareViscon Software[1]—
Data interfaceKLARF input[1]—
Substrate Size—up to 200 mm[2]
Process Capability—Spin coating, Puddle developing[2]
Operation Type—Manual[2]
Tool configuration—LabSpin8 up to 200 mm round or 6" square substrates[4]
Versions—Table-top (TT) and bench-mounted (BM) versions[4]
Max. number of recipes—200[4]
Max. number of process steps—40[4]
Programmable step time—1 - 999 s[4]
Max. spin speed—8,000 rpm +/- 1 rpm (with 200 mm chuck)[4]
Sources (4)Every fact above is drawn from these public sources
  1. [1]dealer listingwotol.com
  2. [2]hilpert.chhilpert.ch
  3. [3]waferpedia.comwaferpedia.com
  4. [4]inseto.co.ukinseto.co.uk