Comparison ledger
Leica , Vistec INS 3000, SUSS MicroTec LabSpin6 / 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | , Vistec INS 3000Leica | LabSpin6 / 8SUSS MicroTec |
|---|---|---|
| OEM | Leica | SUSS MicroTec |
| Category | — | — |
| Wafer size | 200mm | 200mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Leica , Vistec INS 3000 | SUSS MicroTec LabSpin6 / 8 |
| Specifications | ||
| Wafer size | Single 150/200 mm wafer loadport[1] | up to 200 mm[3] |
| Type | Optical defect review station[1] | — |
| Wafer loadport | Single 150/200 mm wafer loadport[1] | — |
| Lighting | Bright field light source; DIC DUV light source[1] | — |
| Camera | UV and DUV camera[1] | — |
| Optics | 6 optics: 150x, 100x, 50x, 25x, 10x, 5x[1] | — |
| Software | Viscon Software[1] | — |
| Data interface | KLARF input[1] | — |
| Substrate Size | — | up to 200 mm[2] |
| Process Capability | — | Spin coating, Puddle developing[2] |
| Operation Type | — | Manual[2] |
| Tool configuration | — | LabSpin8 up to 200 mm round or 6" square substrates[4] |
| Versions | — | Table-top (TT) and bench-mounted (BM) versions[4] |
| Max. number of recipes | — | 200[4] |
| Max. number of process steps | — | 40[4] |
| Programmable step time | — | 1 - 999 s[4] |
| Max. spin speed | — | 8,000 rpm +/- 1 rpm (with 200 mm chuck)[4] |