Comparison ledger
Logitech 1 WBS 1 Wafer Substrate, MRSI H3TO, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 1 WBS 1 Wafer SubstrateLogitech | H3TOMRSI |
|---|---|---|
| OEM | Logitech | MRSI |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | 2018 Launch announcement |
| Control system | — | Windows |
| Generation | — | — |
| Family | Logitech 1 WBS 1 Wafer Substrate | MRSI H3TO |
| Cited variants | — | |
| Specifications | ||
| Wafer Size | 6 inch[2] | — |
| family | — | MRSI-H family[1] |
| design focus | — | handling multi-dies and multi-processes for complex TO products without tool changeover[1] |
| example products | — | TO-based EMLs and WDM LDs for 5G[1] |
| tooling/processing | — | TO handling module combined with pick and place head for dual parallel processing[1] |
| bonding capability | — | capability of both epoxy and eutectic die bonding in one process flow[1] |
| Type | — | high-speed die bonder[3] |
| Placement accuracy | — | 3 micrometer[3] |
| Designed for | — | handling multi-dies and multi-processes for complex TO products without tool changeover[1] |
| Control-system era | — | Windows[4] |
| Dual-head motion system | — | TO pick-and-place/handling and die bonding in parallel[3] |
| Auto tool changer | — | twelve vacuum tips/collets integrated on the bonding head for zero time tool change between dies[3] |
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