Comparison ledger
MPI TS2000-IFE, Rorze 03 RR 8120-001-001 Wafer Exchanger, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | TS2000-IFEMPI | |
|---|---|---|
| OEM | MPI | Rorze |
| Category | Test & Probe | Test & Probe |
| Wafer size | 200mm | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | MPI TS2000-IFE | Rorze 03 RR 8120-001-001 Wafer Exchanger |
| Specifications | ||
| Base tool | MPI TS2000-IFE 200-mm automated probe station[1] | — |
| Precision | micron precision[1] | — |
| Probe types in standard configuration | two RF probes of GSG, GSSG or GSGSG types[1] | — |
| Included instruments | microscope and digital camera[1] | — |
| Thermal chuck temperature range | -60°C to +200 °C[1] | — |
| Motion/control | probes, microscope, and chuck are automatically controlled in x, y, and z directions with optical feedback[1] | — |
| RF VNA | Anritsu 4-Port ME7838G vector network analyzer capable of a single sweep from 70 kHz to 220 GHz[1] | — |
| DC bias supply | up to 12 DC bias can be supplied by an Agilent 4156C probe station precision semiconductor parameter analyzer capable of +/-200 V, 0.5 A, and 100 V/us pulses[1] | — |
| Model | TS2000-IFE[1] | 03 RR 8120-001-001[4] |
| OEM | MPI[1] | — |
| Category | Test & Probe[1] | — |
| Wafer size | 200 mm[1] | 8 inch[4] |
| System type | Fully automated probe system[2] | — |
| Supported wafer sizes | 100, 150 or 200 mm[3] | — |
| Primary applications | mmW, load-pull, SiPh, and Product Engineering[2] | — |
| IceFreeEnvironment temperature range | -60 °C to +300 °C[2] | — |
| Chuck XY stage travel range | 220 x 490 mm[3] | — |
| Chuck XY stage resolution | 0.2 μm[3] | — |
| Chuck XY stage accuracy | < 2.0 μm[3] | — |
| Manufacturer | — | Rorze[4] |
| Equipment type | — | Wafer Exchanger[4] |
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