TS2000-IFE

The MPI TS2000-IFE is a fully automated probe system for wafers up to 200 mm. The TS2000-IFE series is positioned for dedicated mmW, load-pull, silicon photonics, and product engineering work. The TS2000-IFE can also be configured with WaferWallet MAX for automated measurement of 100 mm, 150 mm, and 200 mm wafers.^[4][3]

The MPI TS2000-IFE uses programmable chuck motion in X, Y, Z, and theta for wafer positioning. The chuck XY stage has a travel range of 220 x 490 mm, 0.2 μm resolution, accuracy of less than 2.0 μm, repeatability of less than 1 μm, and speed from 10 μm/sec to 50 mm/sec. The chuck Z stage has 30 mm travel, 0.2 μm resolution, accuracy of less than 2.0 μm, repeatability of less than 1.0 μm, and speed from 10 μm/sec to 20 mm/sec. The theta stage has ± 5.0° travel and 0.0001° resolution.^[2]

The MPI TS2000-IFE supports simultaneous use of probe cards and MicroPositioners through the IceFreeEnvironment feature, including operation at temperatures down to -60 °C. The platform supports up to 10 DC MicroPositioners or a 4 DC plus 4 RF MicroPositioner setup, and it also supports a 4.5 x 11 inch probe card holder. The TS2000-IFE includes integrated active vibration isolation, automated dew point control through STM, front loading for wafers or single DUTs, and integrated touchscreen-based thermal chuck control. The platen-to-chuck distance is minimized for mmW probing and active probe use.^[2]

Probe systems are used after wafer fabrication has produced testable structures and before singulation, packaging, or packaged final test. Probe systems support engineering characterization, design validation, failure analysis, reliability studies, and parametric measurement directly on intact wafers. Probe systems can also be used alongside calibration substrates and test structures that are fabricated with the product wafer flow.

Probe systems are used wherever devices must be measured on wafer before separation from the substrate. Probe systems can support electrical characterization, radio-frequency measurements, photonic device evaluation, sensor testing, and reliability work by presenting stable device contacts to laboratory instruments. In development and failure-analysis settings, probe systems allow repeated access to specific die and structures without requiring packaging.