Waferpedia

Comparison ledger

S 204 Bversus150 e Mask

Nikon S 204 B, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
S 204 BNikon
150 e MaskSUSS MicroTec
OEMNikonSUSS MicroTec
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run2002–—
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyNikon S 204 BSUSS MicroTec 150 e Mask
Specifications
OEMNikon[1]—
ModelS 204 B[1]—
Machine designationNSR-S204B[2]—
Equipment typeStepper[1]—
Exposure wavelength248nm[3]—
Laser typeKrF excimer laser[3]—
Reduction ratio4:1[3]—
NA0.68 (max)[3]—
Wafer size300mm[3]—
Reticle size6"[3]—
Field size25 x 33 mm2[3]—
ManufacturedJune 2002[3]—
CategoryLithography[3]—
System designationNSR-S204B[2]—

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Sources (3)Every fact above is drawn from these public sources
  1. [1]Equipment inventory listing
  2. [2]limitekltd.comlimitekltd.com
  3. [3]f.machineryhost.comf.machineryhost.com