Nikon
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Produced
2002–
Optics
248nm[1]
The Nikon S 204 B is a stepper. The Nikon NSR-S204B is a scanner exposure system for photolithography. The Nikon NSR-S204B uses a 248 nm wavelength, a 4:1 reduction ratio, and a maximum numerical aperture of 0.68. The Nikon NSR-S204B is configured for 6 inch reticles and 300 mm wafers. The Nikon NSR-S204B has a 25 x 33 mm2 field size.[3][2][1][5][4]
The Nikon NSR-S204B uses a projection lens with 4:1 reduction imaging. The Nikon NSR-S204B uses software controlled variable numerical aperture from 0.55 to 0.68. The Nikon NSR-S204B uses a KrF excimer laser light source at 248 nm. The Nikon NSR-S204B is equipped with a standard beam matching unit. The Nikon NSR-S204B includes Laser Step Alignment and Field Image Alignment. The Nikon NSR-S204B includes a real time focus and level sensor, chip leveling, and MAC real time lens control. The Nikon NSR-S204B includes an air bearing wafer stage with linear motors, a robotic wafer loader Type III, non contact prealignment, and a Nikon standard reticle loader.[1][5][4]
Lithography tools are used after wafer preparation steps such as film formation and photoresist coating. Lithography exposure is followed by post exposure bake, development, and then a pattern transfer or modification step such as etch or implant. Repeated lithography cycles are used throughout device fabrication to define successive layers.
Documented failure modes, common issues, and field considerations.
Manufactured in June 2002.
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A lithography machine transfers a patterned image into photoresist on a substrate so that later processing can selectively modify the exposed material stack.
Alignment is critical because each new patterned layer must register accurately to features already formed on the substrate. Poor registration can cause electrical, structural, or dimensional errors in later device fabrication.
No. Machines of this class create the resist pattern that guides later operations. The actual material removal, addition, or modification is typically performed in separate process tools after development.
Class-level outcome depends on stable imaging optics, consistent exposure control, focus behavior, stage accuracy, resist condition, substrate flatness, and the quality of alignment to previous layers.
The following facts about the S 204 B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented variants, configuration options, or revision breakpoints of the S 204 B are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the S 204 B are not on record.
Answerable by: an engineer who operated it or OEM installation records
The process node or technology generation of the S 204 B is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the S 204 B are on record.
Answerable by: an OEM parts catalog or a service engineer
No publicly hosted manuals, SOPs, or datasheets for the S 204 B are on record.
Answerable by: university cleanroom staff or an OEM application specialist
Last updated Oct 16, 2026.
Brooks 017-0146-01 is a prealigner manufactured by Brooks.
The Ultratech 1000 Family is a photolithography step-and-repeat 1X steppers family using the Wynne Dyson optical design.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.