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Nikon

S 204 B

LithographyProduced 2002–Nikon S 204 B family
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Provisional entry — research in progress

This page was generated automatically from cited public sources and hasn't completed the full research pass yet. Every specification shown carries its source; more detail is added as research completes.

S 204 B — Inventory photo
Fig. 01S 204 BInventory photo[2]

Produced

2002–

Optics

248nm[1]

What it is

The Nikon S 204 B is a stepper. The Nikon NSR-S204B is a scanner exposure system for photolithography. The Nikon NSR-S204B uses a 248 nm wavelength, a 4:1 reduction ratio, and a maximum numerical aperture of 0.68. The Nikon NSR-S204B is configured for 6 inch reticles and 300 mm wafers. The Nikon NSR-S204B has a 25 x 33 mm2 field size.[3][2][1][5][4]

How it works

The Nikon NSR-S204B uses a projection lens with 4:1 reduction imaging. The Nikon NSR-S204B uses software controlled variable numerical aperture from 0.55 to 0.68. The Nikon NSR-S204B uses a KrF excimer laser light source at 248 nm. The Nikon NSR-S204B is equipped with a standard beam matching unit. The Nikon NSR-S204B includes Laser Step Alignment and Field Image Alignment. The Nikon NSR-S204B includes a real time focus and level sensor, chip leveling, and MAC real time lens control. The Nikon NSR-S204B includes an air bearing wafer stage with linear motors, a robotic wafer loader Type III, non contact prealignment, and a Nikon standard reticle loader.[1][5][4]

Where it fits in the process flow

General reference — not yet source-verified

Lithography tools are used after wafer preparation steps such as film formation and photoresist coating. Lithography exposure is followed by post exposure bake, development, and then a pattern transfer or modification step such as etch or implant. Repeated lithography cycles are used throughout device fabrication to define successive layers.

Why won't it start?

Documented failure modes, common issues, and field considerations.

  • The equipment has some functionality issues.
  • The equipment has shot problems.
  • Stage SYNC improvement is necessary.
  • Alignment problems occur inter field.
  • Intermittent shot failures occur during exposure.

What do the numbers mean?

Wafer handling1

Wafer size
300mm[1]
Accurate?

Optics & imaging4

Exposure wavelength
248nm[1]
Accurate?
Laser type
KrF excimer laser[1]
Accurate?
Reticle size
6"[1]
Accurate?
Reticle size
6 inch[4]
Accurate?

Configuration & options10

OEM
Nikon[3]
Accurate?
Model
S 204 B[3]
Accurate?
Machine designation
NSR-S204B[4]
Accurate?
Equipment type
Stepper[3]
Accurate?
Reduction ratio
4:1[1]
Accurate?
NA
0.68 (max)[1]
Accurate?
Field size
25 x 33 mm2[1]
Accurate?
Manufactured
June 2002[1]
Accurate?
Category
Lithography[1]
Accurate?
System designation
NSR-S204B[4]
Accurate?

Vintage & configurations

  1. 2002-06Production start[1]

    Manufactured in June 2002.

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Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

No research found yet — worked with this tool? Share what you know.

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Frequently asked questions

What does a lithography machine do?General reference — not yet source-verified

A lithography machine transfers a patterned image into photoresist on a substrate so that later processing can selectively modify the exposed material stack.

Why is alignment important in lithography?General reference — not yet source-verified

Alignment is critical because each new patterned layer must register accurately to features already formed on the substrate. Poor registration can cause electrical, structural, or dimensional errors in later device fabrication.

Does the lithography tool directly etch or deposit material?General reference — not yet source-verified

No. Machines of this class create the resist pattern that guides later operations. The actual material removal, addition, or modification is typically performed in separate process tools after development.

What determines the quality of a lithography result?General reference — not yet source-verified

Class-level outcome depends on stable imaging optics, consistent exposure control, focus behavior, stage accuracy, resist condition, substrate flatness, and the quality of alignment to previous layers.

Not publicly documented

The following facts about the S 204 B are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented variants, configuration options, or revision breakpoints of the S 204 B are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the S 204 B are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • The process node or technology generation of the S 204 B is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

  • No publicly documented compatible parts, consumables, or accessories for the S 204 B are on record.

    Answerable by: an OEM parts catalog or a service engineer

  • No publicly hosted manuals, SOPs, or datasheets for the S 204 B are on record.

    Answerable by: university cleanroom staff or an OEM application specialist

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]f.machineryhost.com — f.machineryhost.comf.machineryhost.com
  2. [2]Inventory photo
  3. [3]Equipment inventory listing
  4. [4]limitekltd.com — limitekltd.comlimitekltd.com
  5. [5]Nikon NSR-S204B — wotol.comwotol.com
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Last updated Oct 16, 2026.

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