Comparison ledger
OAI Model 2000, SUSS MicroTec 150 e Mask, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Model 2000OAI | 150 e MaskSUSS MicroTec |
|---|---|---|
| OEM | OAI | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | OAI Model 2000 | SUSS MicroTec 150 e Mask |
| Cited variants | — | |
| Specifications | ||
| Product category | UV Exposure Systems[2] | — |
| Type | Edge-bead and UV flood exposure system[1] | — |
| Exposure beam size | Up to 300mm diameter[1] | — |
| Beam divergence | < 2.0° (1/2 angle)[1] | — |
| Beam spectrum | Near UV, Mid UV, Deep UV[1] | — |
| Beam uniformity | ±5.0%[1] | — |
| Timer | 0.1 to 999.9 sec. (0.1 sec. increments)[1] | — |
| Power supplies | 200W to 5,000W[1] | — |
| Power regulation | Better than ±0.5%[1] | — |
| Intensity control | Dual channel optical feedback loop with ±2% precision and long term repeatability[1] | — |
| Wafer capacity | To 300mm[1] | — |
| Substrate transfer | Cassette-to-cassette[1] | — |
| Handling | Vacuum arm (end effector)[1] | — |
| Flat orientation | ±1 degree[1] | — |
| Precision | ±25 microns[1] | — |
| Z precision | ±12.5 microns[1] | — |
| Electrical | 208/60Hz 3-phase[1] | — |
| Vacuum | 25" Hg[1] | — |
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