OAI
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The OAI Model 2000 is an edge-bead and UV flood exposure system. The OAI Model 2000 includes a UV lightsource, an intensity controlling power supply, and a robotic substrate handling subsystem. The OAI Model 2000 has wafer capacity up to 300mm.[1]
Power
200W to 5,000W[1]
Vacuum
Vacuum arm (end effector)[1]
Performance
±5.0%[1]
Optics
UV Exposure Systems[2]
The OAI Model 2000 is an edge-bead and UV flood exposure system. The OAI Model 2000 may be configured either as an edge-bead exposure tool or as a flood exposure system. The OAI 2000SM is the edge-bead configuration. The OAI 2000FL is the flood exposure configuration. The Model 2000 includes a UV lightsource, an intensity-controlling power supply, and a robotic substrate handling subsystem.[1]
The OAI Model 2000 uses UV lightsources that provide uniform intensity beams with divergence half-angles of less than two degrees. The OAI Model 2000 uses intensity controller sensors linked directly to the lightsource for intensity monitoring. The OAI Model 2000 uses a microprocessor-controlled robotic substrate handling system that may be programmed for a variety of substrate sizes. The OAI Model 2000SM uses standard shadow mask technology for edge-bead exposure. The shadow mask capability allows top-side patterning while the substrate is held in very close proximity to the mask. At a separation of twenty-five microns, the system is capable of six micron resolution.[1]
The OAI 2000FL is used to augment and enhance photolithography processes in production and research and development settings. The OAI 2000SM is intended for edge-bead exposure using shadow masks. The OAI Model 2000SM can reduce particle contamination associated with routine wafer handling. The OAI 2000FL exposes the entire substrate at one time, and its throughput is independent of pattern complexity.[1]
The OAI 2000FL is used for photoresist stabilization and modification. The OAI 2000FL is used for image reversal processes. The OAI 2000FL is used for PCM processes. The OAI 2000SM supports edge-bead exposure by changing the shadow mask to change the exposure pattern.[1]
| Designation | Generation | Vintage | Changes | Source |
|---|---|---|---|---|
| OAI 2000SM | — | — | Edge-bead exposure system configured for standard shadow mask technology. | oainet.speedstorecdn.com[1] |
| OAI 2000FL | — | — | Flood exposure system used to augment and/or enhance photolithography processes in production and R&D settings. | oainet.speedstorecdn.com[1] |
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The OAI Model 2000 may be configured either as an edge-bead exposure tool or as a flood exposure system. The edge-bead version is the OAI 2000SM, and the flood version is the OAI 2000FL.[1]
The following facts about the Model 2000 are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the Model 2000 are on record.
Answerable by: OEM historical records or a trade-press announcement
The control-system platform and OS era of the Model 2000 are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the Model 2000 are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the Model 2000 is not on record.
Answerable by: an OEM datasheet or a fab qualification report
No publicly documented compatible parts, consumables, or accessories for the Model 2000 are on record.
Answerable by: an OEM parts catalog or a service engineer
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Last updated Oct 19, 2026.
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