Waferpedia

Comparison ledger

Model 2000versus1000 Family

OAI Model 2000, Ultratech 1000 Family, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
1000 FamilyUltratech
OEMOAIUltratech
CategoryLithographyLithography
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyOAI Model 2000Ultratech 1000 Family
Cited variants—
Specifications
Product categoryUV Exposure Systems[2]—
TypeEdge-bead and UV flood exposure system[1]—
Exposure beam sizeUp to 300mm diameter[1]—
Beam divergence< 2.0° (1/2 angle)[1]—
Beam spectrumNear UV, Mid UV, Deep UV[1]—
Beam uniformity±5.0%[1]—
Timer0.1 to 999.9 sec. (0.1 sec. increments)[1]—
Power supplies200W to 5,000W[1]—
Power regulationBetter than ±0.5%[1]—
Intensity controlDual channel optical feedback loop with ±2% precision and long term repeatability[1]—
Wafer capacityTo 300mm[1]—
Substrate transferCassette-to-cassette[1]—
HandlingVacuum arm (end effector)[1]—
Flat orientation±1 degree[1]—
Precision±25 microns[1]—
Z precision±12.5 microns[1]—
Electrical208/60Hz 3-phase[1]—
Vacuum25" Hg[1]—
Tool type—Photolithography step-and-repeat 1X stepper[3]
Optical design—Wynne Dyson[3]
Magnification—1X[3]
Tool class—Photolithography step-and-repeat 1X steppers[3]

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Sources (3)Every fact above is drawn from these public sources
  1. [1]oainet.speedstorecdn.comoainet.speedstorecdn.com
  2. [2]oainet.comoainet.com
  3. [3]en.wikipedia.orgen.wikipedia.org