Comparison ledger
Oxford Instruments Ion Beam, Oxford Instruments Ionfab 300 Plus IBD, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Ion BeamOxford Instruments | Ionfab 300 Plus IBDOxford Instruments |
|---|---|---|
| OEM | Oxford Instruments | Oxford Instruments |
| Category | Deposition | Deposition |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Oxford Instruments Ion Beam | Oxford Instruments Ionfab 300 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | DC Hot Wire Filament Ion-Guns[2] | — |
| Ion source type | DC hot wire filament[2] | — |
| Substrate motion | Planetary system[2] | — |
| Thickness monitoring | Quartz crystal microbalance (QCM)[2] | — |
| Substrate handling | Planetary system[2] | — |
| Film thickness monitoring | QCM for layer thickness[2] | — |
| Thickness Monitoring | QCM (Quartz Crystal Microbalance)[2] | — |
| Contamination | — | II-VI[3] |
| No longer Functioning | — | Software, Automata[3] |
| Category | — | Deposition[4] |
| Family | — | Oxford Instruments Ionfab 300[4] |
| Process type (IBD/IBE configuration) | — | Ion beam deposition and ion beam etching[1] |
| Wafer size | — | 6-inch to 8-inch wafers[1] |
| Wafer handling / throughput configuration | — | Loadlock and robot with secondary pumping; vacuum can remain inside for higher throughput[1] |
| Electrical supply | — | 3 Phase[1] |
| Vintage | — | 2013[3] |
| Functional status (as reported on one unit) | — | No longer functioning: Software, Automata[3] |
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