Comparison ledger
Plasma-Therm Shuttleline ICP, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | Shuttleline ICPPlasma-Therm | 110Tegal |
|---|---|---|
| OEM | Plasma-Therm | Tegal |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Plasma-Therm Shuttleline ICP | Tegal 110 |
| Cited variants | — |
|
| Specifications | ||
| Configuration | Etched III-V materials[2] | — |
| Wafer Size | 6 inch[2] | — |
| Etched Materials | III-V materials[2] | — |
| External pumps and chiller | Not included[2] | — |
| Tool type | Inductively coupled plasma etcher[2] | — |
| Process material | III-V materials[2] | — |
| Vacuum & pumping | External pumps and chiller not included[3] | — |
| model | — | 110 SE[1] |
| application focus | — | process development applications[1] |
| process capability | — | deep silicon plasma etching[1] |
| capabilities | — | very high aspect ratio trench etch and profile control[1] |
| configuration | — | multiple configurations with minimum technical intervention[1] |
| System type | — | plasma etch system[4] |
| Supported components | — | MEMS and 3D-IC components[1] |
| Control capability | — | very high aspect ratio trench etch and profile control[4] |
| Physical description | — | compact[1] |
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