Comparison ledger
Rorze 03 RR 8120-001-001 Wafer Exchanger, Signatone CM 210, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | CM 210Signatone | |
|---|---|---|
| OEM | Rorze | Signatone |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Rorze 03 RR 8120-001-001 Wafer Exchanger | Signatone CM 210 |
| Specifications | ||
| Wafer size | 8 inch[1] | 200 mm[3] |
| Manufacturer | Rorze[1] | — |
| Model | 03 RR 8120-001-001[1] | CM 210[5] |
| Equipment type | Wafer Exchanger[1] | — |
| Chuck XY Stage Travel Range | — | 205 mm x 205 mm (8.07 x 8.07 in)[3] |
| Chuck XY Travel Resolution (Standard) | — | 14 μm Per Degree of Knob Rotation[3] |
| Chuck XY Travel Resolution (Fine) | — | 1.5 μm Per Degree of Knob Rotation[3] |
| Chuck Z Stage Travel Range | — | 2.5 mm (0.01 in)[3] |
| Chuck Z Stage Repeatability | — | ± 1.0 μm[3] |
| Chuck Theta Stage Travel Range | — | ± 11° (22°)[3] |
| Chuck Theta Stage Accuracy | — | < 1.0 μm (measured at the edge of the 200 mm chuck)[3] |
| Probe Platen Material | — | Nickel Plated Steel (Aluminum optional)[3] |
| Probe Platen Dimensions | — | L = 580mm x W = 637mm x H = 12.7mm[3] |
| Max Number of Micro Positioners | — | 10x DC/HV or 2x RF + 4x DC or 4x RF + 2x DC or 2x CAP + 4x DC[3] |
| Contact Repeatability | — | < 1 μm (0.04 mils) by Manual Control[3] |
| Standard Wafer Chuck Diameter | — | 203 mm[3] |
| Standard Wafer Chuck Surface Planarity | — | ±6.5 μm[3] |
| Standard Wafer Chuck Rigidity | — | <3 μm / 10N at edge of the chuck[3] |
| Coax Chuck Operation Voltage | — | -200V to +200V DC[3] |
| Coax Chuck Max Voltage (Chuck to GND) | — | 500 V DC[3] |
| Coax Chuck Isolation | — | > 150 GΩ[3] |
| Triax Chuck Isolation (Force to Guard @ 10V) | — | > 2 TΩ[3] |
| System Dimensions (Optional Table) | — | 660 x 889 x 610 mm (26 x 35 x 24 in)[4] |
| System Weight (Optional Table) | — | 109 kg (240 lbs)[4] |
| System Dimensions Including Table | — | 863 x 1085 x 1370 mm (34 x 42.7 x 53.95 in)[4] |
| System Weight Including Table | — | 385 kg (849 lbs)[4] |
| Available Thermal Chuck Options | — | Standard Hot (25°C to 300°C), Hot/Triax (25°C to 200°C), Hot/3kV Triax (25°C to 200°C)[3] |
| Type | — | Probe station[5] |
| Probe station mode | — | Manual[3] |
| Wafer probing | — | Full or partial wafer probing[3] |
| Applications | — | DC, CV/IV, pulsed-IV, high power, RF[3] |
| RF frequency | — | Up to 110 GHz[3] |
| RF setup | — | 2 & 4 port setup[3] |
| High power application | — | Up to 12 kV / 600 A[3] |
| Chuck XY stage travel | — | 205 mm x 205 mm[3] |
| Chuck Z stage travel | — | 2.5 mm[3] |
| Chuck theta travel | — | ±11° (22°)[3] |
| Standard wafer chuck connectivity | — | Coax BNC (m)[3] |
| Triaxial wafer chuck connectivity | — | Triax (m)[3] |
| Standard wafer chuck material | — | Nickel plated brass (gold optional)[3] |
| Triaxial wafer chuck material | — | Gold plated brass[3] |
| Standard wafer chuck supported DUT sizes | — | 25 mm, 75 mm, 100 mm, 150 mm, 200 mm[3] |
| Triaxial wafer chuck supported DUT sizes | — | 3 mm, 75 mm, 125 mm, 200 mm[3] |
| Triaxial wafer chuck surface planarity | — | ±5 µm[3] |
| Chuck to thermal shield separation | — | Minimum 2 mm[3] |
| Contact repeatability | — | < 1 µm[3] |
| Temperature range, standard hot chuck | — | +25 °C to +300 °C[3] |
| Temperature range, hot triax chuck | — | +25 °C to +200 °C[3] |
| Temperature range, hot 3 kV triax chuck | — | +25 °C to +200 °C[3] |
| Temperature control method | — | Liquid cooled / resistance heater[3] |
| Temperature stability | — | ±0.1 °C[3] |
| Temperature accuracy | — | ±0.5 °C[3] |
| System controller model | — | S-1080, TC-II, 2XRC-89HL[3] |
| System dimensions including table | — | 863 x 1085 x 1370 mm[3] |
| System weight including table | — | 385 kg[3] |
| Standard warranty | — | 12 months[3] |
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