Comparison ledger
Rorze 03 RR 8120-001-001 Wafer Exchanger, SUSS MicroTec PM5, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | PM5SUSS MicroTec | |
|---|---|---|
| OEM | Rorze | SUSS MicroTec |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | 150mm |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Rorze 03 RR 8120-001-001 Wafer Exchanger | SUSS MicroTec PM5 |
| Specifications | ||
| Wafer size | 8 inch[1] | — |
| Manufacturer | Rorze[1] | SÜSS MicroTec AG[4] |
| Model | 03 RR 8120-001-001[1] | — |
| Equipment type | Wafer Exchanger[1] | — |
| system type | — | analytical probe system[3] |
| wafer/substrate diameter | — | up to 150 mm (6″)[3] |
| measurement modes | — | DC and HF measurements[3] |
| failure analysis use | — | suitable as a failure analysis tool[3] |
| probe heads | — | up to 12 SUSS probe heads at one time[3] |
| manipulator probe function | — | nanowires may be picked and placed onto a device or substrate[3] |
| Measurement types | — | DC and HF[3] |
| Max probe heads | — | up to 12 SUSS probe heads[3] |
| Manipulator probe | — | for nanowire pick-and-place[3] |
| Wafer/substrate diameter | — | up to 150 mm (6 in)[3] |
| Failure analysis | — | suitable as a failure analysis tool[3] |
| Contact points | — | up to 4 contact points can be operated independently at the same time[4] |
| Category | — | Characterization[4] |
| Supported substrate diameter | — | up to 150 mm (6 in)[3] |
| Supported wafers, chips, and substrates | — | wafers, chips and substrates up to 150 mm[4] |
| Maximum probe heads | — | up to 12 SUSS probe heads at one time[3] |
| Nanowire handling | — | nanowires may be picked and placed onto a device or substrate[3] |
| Probe head motion | — | X, Y, Z movements[4] |
| Platen height adjustment | — | up to 40 mm[4] |
| Additional contact separation | — | 200 μm[4] |
| Microscope objectives | — | ExtraLongWorkingDistance 2x, 10x, 20x objectives and 10x ocular[4] |
| Chuck stage motion | — | X, Y and Z moved[4] |
| Chuck stage thermal control | — | can be heated/cooled[4] |
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