Waferpedia

Comparison ledger

11600 SRDversusR3

Semitool 11600 SRD, YES R3, side by side. Every value shown is drawn from the cited encyclopedia entries.

Side-by-side comparison of selected equipment models
Attribute
11600 SRDSemitool
R3YES
OEMSemitoolYES
CategoryWet Processing / CleanWet Processing / Clean
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySemitool 11600 SRDYES R3
Specifications
ConfigurationCeramic[1]—
ManufacturerSemitool[1]—
Model11600 SRD[1]—
Equipment typeSpin Rinse Dryer[1]Plasma cleaning system[4]
System type—Plasma cleaner / plasma cleaning system[2]
Control—Sequential microprocessor[2]
Program storage—Up to 90 separate one- or two-gas programs in memory[2]
Power supply—500 Watt[2]
Plasma gas inputs—Two standard; optional third input[2]
Backfill input—Standard[2]
Electrode sets—Two 12-inch square electrode sets standard[2]
Sample tray capacity—Two 12 x 12 in. sample trays; total capacity 325 sq.in.[2]
Sample trays—Two 12 x 12 in.; total capacity 325 sq.in.[2]
Controller—Sequential microprocessor; up to 90 stored one- or two-gas programs[2]
Process gas and modes (UC Santa Barbara configuration)—Oxygen; downstream and direct plasma cleaning[3]
Position in series—Smallest of the series; pilot run quantities[2]
Control system—Sequential microprocessor[2]
Stored programs—Up to 90 separate one- or two-gas programs[2]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]inventory listing
  2. [2]web.archive.orgweb.archive.org
  3. [3]cnsi.ucsb.educnsi.ucsb.edu
  4. [4]web.archive.orgweb.archive.org