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Comparison ledger

EO 222 SRversus110

Semitool EO 222 SR, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
EO 222 SRSemitool
110Tegal
OEMSemitoolTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySemitool EO 222 SRTegal 110
Cited variants—
Specifications
Phase3 Phase[2]—
Configuration5 Wire[3]—
Voltage208 Vac[2]—
Wire configuration5 Wire[2]—
model—110 SE[1]
application focus—process development applications[1]
process capability—deep silicon plasma etching[1]
capabilities—very high aspect ratio trench etch and profile control[1]
configuration—multiple configurations with minimum technical intervention[1]
System type—plasma etch system[4]
Supported components—MEMS and 3D-IC components[1]
Control capability—very high aspect ratio trench etch and profile control[4]
Physical description—compact[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]waferpedia.comwaferpedia.com
  3. [3]inventory listing
  4. [4]waferpedia.comwaferpedia.com