Comparison ledger
Signatone CM 210, SUSS MicroTec P 8, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | CM 210Signatone | P 8SUSS MicroTec |
|---|---|---|
| OEM | Signatone | SUSS MicroTec |
| Category | Test & Probe | Test & Probe |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Signatone CM 210 | SUSS MicroTec P 8 |
| Specifications | ||
| Chuck XY Stage Travel Range | 205 mm x 205 mm (8.07 x 8.07 in)[2] | — |
| Chuck XY Travel Resolution (Standard) | 14 μm Per Degree of Knob Rotation[2] | — |
| Chuck XY Travel Resolution (Fine) | 1.5 μm Per Degree of Knob Rotation[2] | — |
| Chuck Z Stage Travel Range | 2.5 mm (0.01 in)[2] | — |
| Chuck Z Stage Repeatability | ± 1.0 μm[2] | — |
| Chuck Theta Stage Travel Range | ± 11° (22°)[2] | — |
| Chuck Theta Stage Accuracy | < 1.0 μm (measured at the edge of the 200 mm chuck)[2] | — |
| Probe Platen Material | Nickel Plated Steel (Aluminum optional)[2] | — |
| Probe Platen Dimensions | L = 580mm x W = 637mm x H = 12.7mm[2] | — |
| Max Number of Micro Positioners | 10x DC/HV or 2x RF + 4x DC or 4x RF + 2x DC or 2x CAP + 4x DC[2] | — |
| Contact Repeatability | < 1 μm (0.04 mils) by Manual Control[2] | — |
| Standard Wafer Chuck Diameter | 203 mm[2] | — |
| Standard Wafer Chuck Surface Planarity | ±6.5 μm[2] | — |
| Standard Wafer Chuck Rigidity | <3 μm / 10N at edge of the chuck[2] | — |
| Coax Chuck Operation Voltage | -200V to +200V DC[2] | — |
| Coax Chuck Max Voltage (Chuck to GND) | 500 V DC[2] | — |
| Coax Chuck Isolation | > 150 GΩ[2] | — |
| Triax Chuck Isolation (Force to Guard @ 10V) | > 2 TΩ[2] | — |
| System Dimensions (Optional Table) | 660 x 889 x 610 mm (26 x 35 x 24 in)[3] | — |
| System Weight (Optional Table) | 109 kg (240 lbs)[3] | — |
| System Dimensions Including Table | 863 x 1085 x 1370 mm (34 x 42.7 x 53.95 in)[3] | — |
| System Weight Including Table | 385 kg (849 lbs)[3] | — |
| Available Thermal Chuck Options | Standard Hot (25°C to 300°C), Hot/Triax (25°C to 200°C), Hot/3kV Triax (25°C to 200°C)[2] | — |
| Model | CM 210[4] | — |
| Type | Probe station[4] | — |
| Wafer size | 200 mm[2] | — |
| Probe station mode | Manual[2] | — |
| Wafer probing | Full or partial wafer probing[2] | — |
| Applications | DC, CV/IV, pulsed-IV, high power, RF[2] | — |
| RF frequency | Up to 110 GHz[2] | — |
| RF setup | 2 & 4 port setup[2] | — |
| High power application | Up to 12 kV / 600 A[2] | — |
| Chuck XY stage travel | 205 mm x 205 mm[2] | — |
| Chuck Z stage travel | 2.5 mm[2] | — |
| Chuck theta travel | ±11° (22°)[2] | — |
| Standard wafer chuck connectivity | Coax BNC (m)[2] | — |
| Triaxial wafer chuck connectivity | Triax (m)[2] | — |
| Standard wafer chuck material | Nickel plated brass (gold optional)[2] | — |
| Triaxial wafer chuck material | Gold plated brass[2] | — |
| Standard wafer chuck supported DUT sizes | 25 mm, 75 mm, 100 mm, 150 mm, 200 mm[2] | — |
| Triaxial wafer chuck supported DUT sizes | 3 mm, 75 mm, 125 mm, 200 mm[2] | — |
| Triaxial wafer chuck surface planarity | ±5 µm[2] | — |
| Chuck to thermal shield separation | Minimum 2 mm[2] | — |
| Contact repeatability | < 1 µm[2] | — |
| Temperature range, standard hot chuck | +25 °C to +300 °C[2] | — |
| Temperature range, hot triax chuck | +25 °C to +200 °C[2] | — |
| Temperature range, hot 3 kV triax chuck | +25 °C to +200 °C[2] | — |
| Temperature control method | Liquid cooled / resistance heater[2] | — |
| Temperature stability | ±0.1 °C[2] | — |
| Temperature accuracy | ±0.5 °C[2] | — |
| System controller model | S-1080, TC-II, 2XRC-89HL[2] | — |
| System dimensions including table | 863 x 1085 x 1370 mm[2] | — |
| System weight including table | 385 kg[2] | — |
| Standard warranty | 12 months[2] | — |
| Configuration | — | Manual Probe Station[1] |
| Equipment type | — | Manual probe station prober[1] |
| Microscope | — | Mitutoyo Compound Microscope[1] |
| Wafer sizes | — | 8 inch[6] |
Plan your fab
Building a Test & Probe process? Get a complete equipment list.
Open the fab equipment planner →