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Comparison ledger

Synapsversus110

SPTS Synaps, Tegal 110, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
SynapsSPTS
110Tegal
OEMSPTSTegal
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilySPTS SynapsTegal 110
Cited variants—
Specifications
ConfigurationChamber only, for Omega fxP Etch system w/o MF[2]—
Chamber configurationSingle chamber, for Omega fxP Etch system, without MF (matching network)[3]—
Wafer size6 inch[3]—
Equipment typeEtch module[3]—
SystemOmega fxP Etch system[2]—
Matching networkWithout MF (matching network)[3]—
model—110 SE[1]
application focus—process development applications[1]
process capability—deep silicon plasma etching[1]
capabilities—very high aspect ratio trench etch and profile control[1]
configuration—multiple configurations with minimum technical intervention[1]
System type—plasma etch system[4]
Supported components—MEMS and 3D-IC components[1]
Control capability—very high aspect ratio trench etch and profile control[4]
Physical description—compact[1]

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Sources (4)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]inventory listing
  3. [3]waferpedia.comwaferpedia.com
  4. [4]waferpedia.comwaferpedia.com