Comparison ledger
SUSS MicroTec BA 8, SUSS MicroTec BA 8 Contact, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | BA 8SUSS MicroTec | BA 8 ContactSUSS MicroTec |
|---|---|---|
| OEM | SUSS MicroTec | SUSS MicroTec |
| Category | Lithography | Lithography |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec BA 8 | SUSS MicroTec BA 8 |
| Cited variants |
| — |
| Specifications | ||
| Phase | 1+N / 2 Phase[2] | 2 Phase[4] |
| Configuration | 50/60 Hz[2] | 50/60 Hz[4] |
| Power | 1kVA[2] | — |
| Type | bond aligner[3] | — |
| Application | wafer bonding and alignment[3] | — |
| Power frequency | 50/60 Hz[2] | — |
| Voltage | 208-230 V[2] | 208-230 V[4] |
| Alignment capability | submicron wafer-to-wafer bond alignment[1] | — |
| Alignment modes | top, bottom, and multi-layer alignment modes[1] | — |
| Optical options | visible light and infrared[1] | — |
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