SUSS MicroTec

In this class of equipment, the machine is used to position a photomask and wafer or other substrate in precise relative alignment before exposure. Contact aligners are part of the lithography tool set used for pattern definition on light-sensitive films.
A contact aligner brings the mask and coated substrate into close proximity or direct contact during exposure so the mask pattern can be optically transferred into the resist. Alignment is performed before exposure using optical registration features, and the exposure step then defines the pattern in the photoresist.
A contact aligner sits in the lithography step of semiconductor or microfabrication processing, after resist coating and prior to resist development and downstream pattern transfer steps such as etching or deposition. It is used when feature patterns must be repeated from a mask onto a substrate with controlled overlay.
Contact aligners are used for patterning photoresist on wafers and other substrates in microfabrication. They are commonly used in research, process development, and production of devices that require mask-defined features at the lithography stage.
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It is specified with TSA/BSA capability.[1]
The following facts about the BA 8 Contact are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.
No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the BA 8 Contact are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the BA 8 Contact are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the BA 8 Contact are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the BA 8 Contact are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the BA 8 Contact is not on record.
Answerable by: an OEM datasheet or a fab qualification report
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Last updated Jul 29, 2026.
The EVG 101 is an advanced resist processing system for spin or spray coating and developing of wafers up to 300 mm.