Comparison ledger
SUSS MicroTec FC 150 Flip Chip, West Bond 10490, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | FC 150 Flip ChipSUSS MicroTec | 10490West Bond |
|---|---|---|
| OEM | SUSS MicroTec | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | SUSS MicroTec FC 150 Flip Chip | West Bond 10490 |
| Specifications | ||
| Configuration | 100 kg Bond Pressure[1] | — |
| Voltage | 220V, 60Hz[3] | — |
| Frequency | 50 Hz[5] | — |
| Bond Pressure | 50 kg, 100 kg, 200 kg[1] | — |
| Electrical Requirements | 20 Amps, 220V, 60Hz[3] | — |
| Heating Chuck Size | 100 mm[2] | — |
| Universal Bonding Arm (UBA) | 100 mm[2] | — |
| Automatic Alignment | Yes[2] | — |
| Process Recording | Yes[2] | — |
| Chip and Substrate Cassettes | 4 inch[2] | — |
| Chip Flipper | Optional[4] | — |
| Automatic Alignment (Cognex 8000) | Optional[4] | — |
| Advanced Laser Leveling | Optional[4] | — |
| High Precision SET Reflow Arm (SRA) | Optional[4] | — |
| Force Sensor in Stage | Optional[4] | — |
| Cassette Size | 4 inch (100 mm)[2] | — |
| Heating UBA | 100 mm, 200 kg[2] | — |
| Optional: Chip Flipper | Available[4] | — |
| Optional: Advanced Laser Leveling | Available[4] | — |
| Optional: Universal Bonding Arm (UBA) | Available[4] | — |
| Optional: High Precision SET Reflow Arm (SRA) | Available[4] | — |
| Optional: Force Sensor in Stage | Available[4] | — |
| Manufacturer | — | West Bond[6] |
| Model | — | 10490[6] |
| Description | — | Convertible bonder, wedge to ball[7] |
| Tool type | — | Convertible bonder[8] |
| Bonding modes | — | Wedge bonding and ball bonding[8] |
| Use | — | Wire bonding[8] |
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