Waferpedia

SUSS MicroTec

FC 150 Flip Chip

FC 150 Flip Chip — Inventory photo
Fig. 01FC 150 Flip ChipInventory photo[1]

Power

220V, 60Hz[2]

Vacuum

100 kg Bond Pressure[3]

Performance

Automatic Alignment[1]

Optics

Advanced Laser Leveling[4]

What is it?

What do the numbers mean?

Power & electrical1

Voltage
220V, 60Hz[2]
Accurate?

Vacuum & pumping3

100 kg Bond Pressure[3]
Accurate?
200 kg Bond Pressure[1]
Accurate?
50 KG bond pressure[2]
Accurate?

Wafer handling2

Heating Chuck 100mm[1]
Accurate?
4” Chip and Substrate Cassettes[1]
Accurate?

Optics & imaging1

Advanced Laser Leveling[4]
Accurate?

Performance3

Automatic Alignment[1]
Accurate?
Automatic Alignment (Cognex 8000)[4]
Accurate?
High Precision SET Reflow Arm (SRA)[4]
Accurate?

Control & software1

This tool powers on, launches software and completes initialization process (tool reset)[4]
Accurate?

Configuration & options7

Heating UBA 100mm 200Kg[1]
Accurate?
Process Recording[1]
Accurate?
20Amps[2]
Accurate?
Optional equipment installed:[4]
Accurate?
Chip Flipper[4]
Accurate?
Universal Bonding Arm (UBA)[4]
Accurate?
Force Sensor in Stage[4]
Accurate?
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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

  • Configuration100 kg Bond Pressure[3]
  • Configuration200 kg Bond Pressure[1]
  • Configuration50 KG bond pressure[2]
  • Voltage220V, 60Hz[2]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the FC 150 Flip Chip are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

  • No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the FC 150 Flip Chip are on record.

    Answerable by: OEM historical records or a trade-press announcement

  • No publicly documented variants, configuration options, or revision breakpoints of the FC 150 Flip Chip are on record.

    Answerable by: an OEM product catalog or an engineer who ordered or specified the tool

  • The control-system platform and OS era of the FC 150 Flip Chip are not on record.

    Answerable by: an engineer who operated it or OEM installation records

  • No publicly documented failure modes or field errata for the FC 150 Flip Chip are on record.

    Answerable by: a field service engineer, process engineer, or maintenance technician

  • The process node or technology generation of the FC 150 Flip Chip is not on record.

    Answerable by: an OEM datasheet or a fab qualification report

No research found yet — worked with this tool? Share what you know.

Sources & citations

Sources (5)Every fact above is drawn from these public sources
  1. [1]Inventory photo
  2. [2]Inventory photo
  3. [3]inventory listing
  4. [4]inventory listing
  5. [5]Equipment inventory listing
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Last updated Jul 29, 2026.

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