Waferpedia

Comparison ledger

110versusTelius SP 305 DRM Dielectric

Tegal 110, Tokyo Electron Telius SP 305 DRM Dielectric, side by side. Every value shown is drawn from the cited encyclopedia entries.

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Side-by-side comparison of selected equipment models
Attribute
110Tegal
OEMTegalTokyo Electron
CategoryEtchEtch
Wafer size——
Process node——
Introduced——
Production run——
Lifecycle——
Lifecycle milestones——
Control system——
Generation——
FamilyTegal 110Tokyo Electron Telius SP 305 DRM Dielectric
Cited variants—
Specifications
model110 SE[1]—
application focusprocess development applications[1]—
process capabilitydeep silicon plasma etching[1]—
capabilitiesvery high aspect ratio trench etch and profile control[1]—
configurationmultiple configurations with minimum technical intervention[1]—
System typeplasma etch system[2]—
Supported componentsMEMS and 3D-IC components[1]—
Control capabilityvery high aspect ratio trench etch and profile control[2]—
Physical descriptioncompact[1]—

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Sources (2)Every fact above is drawn from these public sources
  1. [1]web.archive.orgweb.archive.org
  2. [2]waferpedia.comwaferpedia.com