Comparison ledger
Tegal 110, Ulvac NE 5000 N, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 110Tegal | NE 5000 NUlvac |
|---|---|---|
| OEM | Tegal | Ulvac |
| Category | Etch | Etch |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | Tegal 110 | Ulvac NE 5000 N |
| Cited variants |
| — |
| Specifications | ||
| model | 110 SE[1] | — |
| application focus | process development applications[1] | — |
| process capability | deep silicon plasma etching[1] | — |
| capabilities | very high aspect ratio trench etch and profile control[1] | — |
| configuration | multiple configurations with minimum technical intervention[1] | — |
| System type | plasma etch system[2] | — |
| Supported components | MEMS and 3D-IC components[1] | — |
| Control capability | very high aspect ratio trench etch and profile control[2] | — |
| Physical description | compact[1] | — |
| Configuration | — | Helium cooling[3] |
| Wafer size | — | 6 inch[3] |
| Cooling | — | Helium cooling[3] |
| Loading/unloading | — | Auto loading & unloading[3] |
| Uniformity | — | +/-3%[3] |
| Gas customization | — | Can customize gas lines based on RFQ[4] |
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