Comparison ledger
West Bond 10100, West Bond 747677E, side by side. Every value shown is drawn from the cited encyclopedia entries.
| Attribute | 10100West Bond | 747677EWest Bond |
|---|---|---|
| OEM | West Bond | West Bond |
| Category | Packaging & Bonding | Packaging & Bonding |
| Wafer size | — | — |
| Process node | — | — |
| Introduced | — | — |
| Production run | — | — |
| Lifecycle | — | — |
| Lifecycle milestones | — | — |
| Control system | — | — |
| Generation | — | — |
| Family | West Bond 10100 | West Bond 747677E |
| Specifications | ||
| OEM | — | West Bond[1] |
| Model | — | 747677E[1] |
| Location | — | Sample Prep Room[1] |
| Primary training contact | — | Talmage Tyler[1] |
| Bond force range | — | 10-250 grams[1] |
| Ultrasonics | — | built-in, 4 watts[1] |
| Wire size | — | 1 mil (25.4 um)[1] |
| Ball bond size | — | ~ 85 um[1] |
| Equipment type | — | Wire bonder[2] |
| Primary bonding material | — | Gold wire[1] |
| Bonding configuration | — | Ball bonding[1] |
| Convertible bonding methods | — | Wedge and ball bonding[3] |
| Compatible wire materials | — | Al and Au wires[3] |
| Compatible wire diameter range | — | 0.7 mil to 2 mil[3] |
| Ultrasonic transducer | — | 4 W, 63 kHz[3] |
| Applications | — | Wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices[2] |
| Tool movement range | — | 0.5625 in vertically and 0.6250 in horizontally[4] |
| Tool heat | — | approximately 250 °C for wedge bonding and 200 °C for ball bonding[4] |
| Work holder | — | 2.25 in x 3.00 in work holder that can heat up to 400 °C[4] |
| ESD protection | — | ESD safe[4] |
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