West Bond

747677E

Packaging & Bonding West Bond 747677E family

Research Quality: 30% complete

West Bond747677E

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Plate 01West Bond 747677E 79 Inv# 64,799
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What is it?

The West Bond 747677E is listed as a wire bonder and described as a manual wirebond tool used for making electrical contacts between semiconductor dies and packages. The source states it uses gold wire in a ball bonding configuration and can be configured for wedge and ball bonding methods.

What can it run?

Process applications and technology nodes documented for this tool.

Wire bonding to interconnect wire leads to semiconductor, hybrid, or microwave devices
Gold wire bonding of devices and packages
Making electrical contacts between semiconductor dies and packages

What do the numbers mean?

Power & electrical1

Ultrasonics: built-in, 4 watts^[1]

Configuration & options7

OEM: West Bond^[1]
Model: 747677E^[1]
Location: Sample Prep Room^[1]
Primary training contact: Talmage Tyler^[1]
Bond force range: 10-250 grams^[1]
Wire size: 1 mil (25.4 um)^[1]
Ball bond size: ~ 85 um^[1]

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What does it need to run?

Site utility requirements, footprint, and infrastructure needed to install and operate this tool. Sourced from public records.

Ultrasonicsbuilt-in, 4 watts^[1]

Where are the manuals?

Generated from public-source data on file. Enter your email to access — nothing is published; details are routed privately.

Not publicly documented

Field notes

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Not publicly documented

The following facts about the 747677E are absent from this record as of this revision. First-hand knowledge or a citation closes a gap; every submission is reviewed before publication.

No publicly documented production dates or lifecycle milestones (introduction, end of production, EOL) for the 747677E are on record.
Answerable by: OEM historical records or a trade-press announcement
No publicly documented variants, configuration options, or revision breakpoints of the 747677E are on record.
Answerable by: an OEM product catalog or an engineer who ordered or specified the tool
The control-system platform and OS era of the 747677E are not on record.
Answerable by: an engineer who operated it or OEM installation records
No publicly documented failure modes or field errata for the 747677E are on record.
Answerable by: a field service engineer, process engineer, or maintenance technician
The process node or technology generation of the 747677E is not on record.
Answerable by: an OEM datasheet or a fab qualification report

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Sources & citations

Sources (3)Every fact above is drawn from these public sources

[1]smif.pratt.duke.edu — smif.pratt.duke.edusmif.pratt.duke.edu
[2]Equipment & Procedures | Shared Materials Instrumentation Facility — smif.pratt.duke.edusmif.pratt.duke.edu
[3]Wire bonder: manual wedge/ball [WESTBOND-wirebond1] | Quantum-Nano Fabrication and Characterization Facility | University of Waterloo — uwaterloo.cauwaterloo.ca